Invention Application
- Patent Title: THICK POLYIMIDE FILM AND METHOD FOR MANUFACTURING SAME
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Application No.: US17107787Application Date: 2020-11-30
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Publication No.: US20220152912A1Publication Date: 2022-05-19
- Inventor: WEI-HSIN HUANG , CHI-FEI HUANG , SZU-HSIANG SU , SHOU-JUI HSIANG , KUAN-WEI LEE
- Applicant: Zhen Ding Technology Co., Ltd.
- Applicant Address: TW Taoyuan
- Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee Address: TW Taoyuan
- Priority: CN202011288794.8 20201117
- Main IPC: B29C53/56
- IPC: B29C53/56 ; B29C53/00 ; B29C53/16

Abstract:
A method for manufacturing a thick polyimide film includes providing a first and second laminated structures. The first and second laminated structures are heated, and the heated first and second laminated structures are wound together to form a third laminated structure. The first polyamic acid gel film of the heated first laminated structure and the second polyamic acid gel film of the heated second laminated structure are overlapped and bonded together to form a third polyamic acid gel film. Two third laminated structures are wound together to form a fourth polyamic acid gel film. A dehydration ring-closure imidization reaction is applied to the fourth polyamic acid gel film by heating to obtain the thick polyimide film. A thick polyimide film manufactured by the method is also disclosed.
Public/Granted literature
- US11524491B2 Method for manufacturing thick polyimide film Public/Granted day:2022-12-13
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