Invention Application
- Patent Title: LAMINATE AND PACKAGING BAG
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Application No.: US17585870Application Date: 2022-01-27
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Publication No.: US20220153006A1Publication Date: 2022-05-19
- Inventor: Ryota TANAKA , Ayumi TANAKA , Takeshi NISHIKAWA
- Applicant: TOPPAN INC.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN INC.
- Current Assignee: TOPPAN INC.
- Current Assignee Address: JP Tokyo
- Priority: JP2019-138972 20190729
- Main IPC: B32B27/32
- IPC: B32B27/32 ; B32B27/08

Abstract:
A laminate including a first base material layer, a second base material layer, and a sealant layer in this order, wherein all three layers include a polyolefin film; the polyolefin film of the first base material layer or the second base material layer includes an inorganic oxide layer on at least one surface thereof; and each of the first base material layer, the second base material layer, and the sealant layer has a heat shrinkage rate, in a travel direction after heating at 120° C. for 15 minutes, which satisfies the following inequalities: heat shrinkage rate of the second base material layer≤5% (Inequality 1); heat shrinkage rate of the second base material layer≥heat shrinkage rate of the first base material layer (Inequality 2); and, heat shrinkage rate of the second base material layer≥heat shrinkage rate of the sealant layer (Inequality 3). ws
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