Invention Application
- Patent Title: SEALANT AND SEALANT COMPOSITION FOR ELECTROCHEMICAL DEVICE
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Application No.: US17593387Application Date: 2020-03-05
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Publication No.: US20220153967A1Publication Date: 2022-05-19
- Inventor: Kouichirou MAEDA
- Applicant: ZEON CORPORATION
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: ZEON CORPORATION
- Current Assignee: ZEON CORPORATION
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Priority: JP2019-053493 20190320
- International Application: PCT/JP2020/009432 WO 20200305
- Main IPC: C08L9/00
- IPC: C08L9/00 ; H01M50/193 ; H01M10/0525
Abstract:
A sealant for an electrochemical device contains (A) a conjugated diene polymer and (B) a polyisobutylene polymer. The sealant contains the (A) conjugated diene polymer in a proportion of more than 80 mass % and not more than 98 mass % and the (B) polyisobutylene polymer in a proportion of not less than 2 mass % and less than 20 mass % relative to the total mass of the (A) conjugated diene polymer and the (B) polyisobutylene polymer.
Information query
