Invention Application
- Patent Title: COMPOUND FOR BONDED MAGNET, BONDED MAGNET, METHOD OF PRODUCING SAME, AND RESIN COMPOSITION FOR BONDED MAGNETS
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Application No.: US17455155Application Date: 2021-11-16
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Publication No.: US20220157520A1Publication Date: 2022-05-19
- Inventor: Satoshi YAMANAKA , Takayuki YANO , Shuichi TADA , Masahiro ABE , Kenta IWAI
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2020-191743 20201118,JP2020-192544 20201119,JP2020-201165 20201203,JP2021-008210 20210121,JP2021-008211 20210121,JP2021-008212 20210121
- Main IPC: H01F41/02
- IPC: H01F41/02 ; H01F1/057 ; B29B7/88 ; B29C45/00

Abstract:
A method of producing a compound for bonded magnets, the method including: heat-curing a thermosetting resin and a curing agent having a ratio of the number of reactive groups of the curing agent to the number of reactive groups of the thermosetting resin of at least 2 but not higher than 11 to obtain an additive for bonded magnets; and kneading the additive for bonded magnets, magnetic powder, and a thermoplastic resin to obtain a compound for bonded magnets in which a filling ratio of the magnetic powder is at least 91.5% by mass.
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