Invention Application
- Patent Title: ANTENNA STRUCTURE COMPRISING TRANSMISSION LINE FOR TRANSITIONING AND FEEDING BETWEEN MULTIPLE FREQUENCY BANDS AND ELECTRONIC DEVICE COMPRISING SAME
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Application No.: US17440474Application Date: 2020-03-20
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Publication No.: US20220159826A1Publication Date: 2022-05-19
- Inventor: Sumin YUN , Dongyeon KIM , Seongjin PARK , Sehyun PARK , Woomin JANG , Myunghun JEONG , Jehun JONG , Jaehoon JO
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2019-0032354 20190321
- International Application: PCT/KR2020/003871 WO 20200320
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01Q13/02 ; H01Q1/22 ; H05K5/00 ; H01P3/08 ; H05K1/11 ; H01P1/20

Abstract:
Disclosed is an electronic device comprising: a housing comprising a first plate, a second plate, and a side member, the side member having a first part comprising a first surface, a second surface, a through-hole formed from the first surface to the second surface in a first direction in which same penetrates the side member, and a nonconductive material; a display; a printed circuit board comprising a third surface, a fourth surface, a first conductive layer, a second conductive layer, a feeding line, a conductive pattern, a conductive via, a third conductive layer disposed between the first conductive layer and the second conductive layer, a fourth conductive layer disposed between the first conductive layer and the third conductive layer, multiple first side vias formed so as to electrically connect the first conductive layer and the third conductive layer and to be spaced apart from the conductive via by a first distance in a second direction, which is perpendicular to the first direction, and in which same face away from the through-hole and the slit, and multiple second side vias formed so as to electrically connect the third conductive layer and the fourth conductive layer and to be spaced apart from the conductive via by a second distance, which is different from the first distance, in the second direction; and at least one wireless communication circuit. Various other embodiments recognizable from the specification are also possible.
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