Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE
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Application No.: US17381985Application Date: 2021-07-21
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Publication No.: US20220165722A1Publication Date: 2022-05-26
- Inventor: Sang Cheon PARK , Dae-Woo Kim , Taehun Kim , Hyuekjae Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0161370 20201126
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/31 ; H01L23/498 ; H01L23/48

Abstract:
A semiconductor package includes a redistribution substrate, a first memory chip provided on the redistribution substrate, the first memory chip comprising a first base layer, a first circuit layer provided on a top surface of the first base layer, and a first via penetrating the first base layer and connected to the first circuit layer and the redistribution substrate, a logic chip provided on the first memory chip, and a first molding layer surrounding the first memory chip. An outer side surface of the first molding layer is coplanar with a side surface of the logic chip. At an interface of the logic chip and the first memory chip, a first chip pad provided in the first circuit layer of the first memory chip and a second chip pad of the logic chip are formed of the same material and constitute one body.
Public/Granted literature
- US11798929B2 Semiconductor package Public/Granted day:2023-10-24
Information query
IPC分类: