Invention Application
- Patent Title: CONDUCTIVE METAL PASTE
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Application No.: US17598995Application Date: 2019-03-29
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Publication No.: US20220172858A1Publication Date: 2022-06-02
- Inventor: Gen Masuda
- Applicant: Nisshinbo Holdings Inc.
- Applicant Address: JP Tokyo
- Assignee: Nisshinbo Holdings Inc.
- Current Assignee: Nisshinbo Holdings Inc.
- Current Assignee Address: JP Tokyo
- International Application: PCT/JP2019/014091 WO 20190329
- Main IPC: H01B1/22
- IPC: H01B1/22
Abstract:
The purpose of the present invention is to provide a conductive metal paste having improved conductivity without increasing the amount of a conductive filler to be added. The conductive metal paste contains a metal filler and less than 1 mass % of an ionic liquid, and does not contain carbon nanotubes.
Public/Granted literature
- US11769606B2 Conductive metal paste Public/Granted day:2023-09-26
Information query
