• Patent Title: SOLID-STATE IMAGING DEVICE, IMAGING SYSTEM, AND IMAGING METHOD
  • Application No.: US17598532
    Application Date: 2020-02-05
  • Publication No.: US20220182569A1
    Publication Date: 2022-06-09
  • Inventor: Takashi WATANABE
  • Applicant: TOPPAN INC.
  • Applicant Address: JP Taito-ku
  • Assignee: TOPPAN INC.
  • Current Assignee: TOPPAN INC.
  • Current Assignee Address: JP Taito-ku
  • Priority: JP2019-065937 20190329
  • International Application: PCT/JP2020/004437 WO 20200205
  • Main IPC: H04N5/378
  • IPC: H04N5/378 H04N5/3745 H04N5/369
SOLID-STATE IMAGING DEVICE, IMAGING SYSTEM, AND IMAGING METHOD
Abstract:
[Problem] To provide a solid-state imaging device enabling summed-readout mode and cyclic-readout mode.
[Solution]
A device includes virtual-pixel units implemented by pixels of transfer-route controlling-scheme, the virtual-pixel units having a shape of polygon, the polygons are tessellated. The virtual-pixel unit encompasses a photoelectric-conversion region, charge detectors to which ordinal numbers are labeled, configured to accumulate signal charges transferred from the photoelectric-conversion region, and transfer-control elements configured to control movement of signal charges from the photoelectric-conversion region to one of the charge detectors. N pieces of charge detectors of the same ordinal number are arranged in boundary between the photodiodes and the intersection-shared sites. The intersection-shared site encompasses N pieces of switching elements having first main electrode connected to the charge detectors, and common signal-readout circuit having input terminals connected to second main electrode of each of the switching elements.
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