Invention Application
- Patent Title: Heat Radiator, Electronic Device, and Vehicle
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Application No.: US17682186Application Date: 2022-02-28
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Publication No.: US20220183192A1Publication Date: 2022-06-09
- Inventor: Yaofeng Peng , Jianqiang Yin
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN201910818019.X 20190830
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat radiator comprising a heat dissipation plate, where a plurality of circumferentially disposed heat dissipation regions are disposed on the heat radiator, a plurality of first heat dissipation fins disposed in parallel with each other are disposed at intervals in each heat dissipation region, a heat dissipation channel is formed between adjacent first heat dissipation fins, one end that is of the heat dissipation channel and that is away from a center of the heat dissipation plate is an air inlet, and a direction that is above the heat dissipation channel and that is towards a hollow region is an air outlet.
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