- 专利标题: CYCLIC IMIDE RESIN COMPOSITION, PREPREG, COPPER-CLAD LAMINATE AND PRINTED-WIRING BOARD
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申请号: US17549260申请日: 2021-12-13
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公开(公告)号: US20220195189A1公开(公告)日: 2022-06-23
- 发明人: Hiroyuki IGUCHI , Masayuki IWASAKI , Naoyuki KUSHIHARA
- 申请人: Shin-Etsu Chemical Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2020-213136 20201223
- 主分类号: C08L79/08
- IPC分类号: C08L79/08 ; C08G73/10 ; C08K5/5317 ; C08J5/24 ; H05K1/18
摘要:
Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: (a) a cyclic imide compound represented by the following formula (1), (b) a cyclic imide compound represented by the following formula (2), and (c) a curing catalyst.