A method for manufacturing a light emitting element includes forming a first semiconductor layer on a substrate, the first semiconductor layer including a semiconductor of a first type; forming an active layer on the first semiconductor layer; forming a second semiconductor layer on the active layer, the second semiconductor layer including a semiconductor of a second type different from the first type; performing an etching process of removing at least a portion of each of the first semiconductor layer, the active layer, and the second semiconductor layer in a direction toward the first semiconductor layer from the second semiconductor layer; and forming a first insulating layer to surround an outer surface of the active layer. The first insulating layer is formed by a wet process.