- Patent Title: COMPOSITE PARTICLE FOR ELECTROCHEMICAL DEVICE FUNCTIONAL LAYER, BINDER COMPOSITION FOR ELECTROCHEMICAL DEVICE FUNCTIONAL LAYER, CONDUCTIVE MATERIAL PASTE FOR ELECTRODE MIXED MATERIAL LAYER, SLURRY FOR ELECTRODE MIXED MATERIAL LAYER, ELECTRODE FOR ELECTROCHEMICAL DEVICE, AND ELECTROCHEMICAL DEVICE
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Application No.: US17593563Application Date: 2020-03-17
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Publication No.: US20220200000A1Publication Date: 2022-06-23
- Inventor: Maki MESUDA , Kenya SONOBE , Yasuhiro ISSHIKI
- Applicant: ZEON CORPORATION
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: ZEON CORPORATION
- Current Assignee: ZEON CORPORATION
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Priority: JP2019-059181 20190326
- International Application: PCT/JP2020/011818 WO 20200317
- Main IPC: H01M4/62
- IPC: H01M4/62 ; H01M10/0525 ; H01M4/04 ; H01M4/36

Abstract:
Provided is a new technique related to electrochemical devices that can sufficiently ensure adhesiveness of a functional layer and safety of an electrochemical device while, on the other hand, causing an electrochemical device to display excellent high-temperature storage characteristics. A composite particle for an electrochemical device functional layer includes a core particle containing a melamine compound and a shell polymer that at least partially covers an outer surface of the core particle and that includes at least one selected from the group consisting of a nitrile group, a carboxy group, a hydroxyl group, a sulfo group, an aldehyde group, and an amide group.
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