Invention Application
- Patent Title: LIQUID BLOW MOLDING DEVICE
-
Application No.: US17614405Application Date: 2020-04-07
-
Publication No.: US20220203596A1Publication Date: 2022-06-30
- Inventor: Kei YOSHINO , Mitsuru SHIOKAWA
- Applicant: YOSHINO KOGYOSHO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: YOSHINO KOGYOSHO CO., LTD.
- Current Assignee: YOSHINO KOGYOSHO CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2019-101668 20190530
- International Application: PCT/JP2020/015708 WO 20200407
- Main IPC: B29C49/46
- IPC: B29C49/46 ; B29C49/12 ; B29C49/58

Abstract:
A liquid blow molding apparatus, including: a nozzle configured to define a flow path for a liquid that includes an opening and closing port and a discharge port; a seal body configured to open and close the opening and closing port and includes a guide hole; and a rod configured to move in an axial direction while being guided by the guide hole, wherein the seal body includes a tubular-shaped extension portion configured to extend into the discharge port when the seal body closes the opening and closing port, and a tip surface of the extension portion is configured to have liquid repellency.
Public/Granted literature
- US11992992B2 Liquid blow molding device Public/Granted day:2024-05-28
Information query