Invention Application
- Patent Title: DIELECTRIC MATERIAL AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME
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Application No.: US17523249Application Date: 2021-11-10
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Publication No.: US20220204407A1Publication Date: 2022-06-30
- Inventor: Jae Sung PARK , Hee Sun CHUN , In Tae SEO , Hyung Joon JEON , Chung Eun LEE , Jong Han KIM
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0189832 20201231
- Main IPC: C04B35/468
- IPC: C04B35/468 ; H01G4/30 ; H01G4/248 ; H01G4/232 ; H01G4/12 ; H01C7/00 ; H01C7/10 ; H01C1/148 ; H01F27/29 ; H01F27/28 ; H01L41/047
Abstract:
A dielectric material includes a main component represented by (Ba1-xCax)(Ti1-y(Zr, Sn, Hf)y)O3 (0≤x≤1 and 0≤y≤0.5); a first subcomponent including at least one of elements among Y, Dy, Ho, Er, Gd, Ce, Nd, Nb, Sm, Tb, Eu, Tm, La, Lu, and Yb; a second subcomponent including Si and/or Al; and a third subcomponent including Ba and/or Ca.
Information query
IPC分类:
