Invention Application
- Patent Title: Ceramic material and wire bonding capillary
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Application No.: US17554835Application Date: 2021-12-17
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Publication No.: US20220204409A1Publication Date: 2022-06-30
- Inventor: Tien-Heng HUANG , Yu-Han WU , Kuo-Chuang CHIU
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Main IPC: C04B35/488
- IPC: C04B35/488 ; C04B35/622 ; H01L23/00

Abstract:
A ceramic material includes zirconia toughened alumina (ZTA), which is doped with zinc ions and other metal ions, in which the other metal ions are chromium (Cr) ions, titanium (Ti) ions, gadolinium (Gd) ions, manganese (Mn) ions, cobalt (Co) ions, iron (Fe) ions, or a combination thereof. The ceramic material may have a hardness of 1600 Hv10 to 2200 Hv10 and a bending strength of 600 MPa to 645 MPa. The ceramic material can be used as wire bonding capillary.
Public/Granted literature
- US11964915B2 Ceramic material and wire bonding capillary Public/Granted day:2024-04-23
Information query
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