A temperature probe includes a sheath, a temperature sensitive element, and an insert. The sheath has a sidewall defining an interior space therein. The temperature sensitive element is disposed within the interior space of the sidewall and has an electrical characteristic that varies with temperature. The insert, which is formed of silicon carbide, is operably interposed between the sidewall and the temperature-sensitive element. A method of manufacturing a temperature probe is also provided. A temperature sensing system employing a temperature probe is also provided.