Invention Application
- Patent Title: MULTILAYER CAPACITOR
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Application No.: US17339443Application Date: 2021-06-04
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Publication No.: US20220208455A1Publication Date: 2022-06-30
- Inventor: Hong Gi NAM , Seung In BAIK , Ji Su HONG , Eun Ha JANG , Hee Sun CHUN , Jae Sung PARK
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0186436 20201229
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/30 ; H01G4/248

Abstract:
A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49
Public/Granted literature
- US11657971B2 Multilayer capacitor Public/Granted day:2023-05-23
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