Invention Application
- Patent Title: INTEGRATED HIGH FREQUENCY CONNECTOR
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Application No.: US17577325Application Date: 2022-01-17
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Publication No.: US20220216657A1Publication Date: 2022-07-07
- Inventor: Jason S. Sloey , Ibuki Kamei , Timothy B. Ogilvie , Daniel C. Wagman , Eric S. Jol
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: H01R24/50
- IPC: H01R24/50 ; H01R13/6585 ; H01R12/73 ; H01R12/52

Abstract:
High-speed connectors that save space in an electronic device, are simple to connect, and are readily manufactured. One example can provide a high-speed connector having high-speed connections. The high-speed connections can be integrated with low-speed connections in a board-to-board structure to save space in an electronic device. An example can provide high-speed connections that are simple to connect. The board-to-board structure can include a board-to-board plug, where each high-speed connection includes a high-speed contact having a lateral portion. The lateral portion can include right-angle tabs to guide a central conductor of a coaxial cable. The central conductor of each coaxial cable can be soldered to a corresponding lateral portion. Ground contacts for the board-to-board plug can include crimping portions to connect to an outer shield of each coaxial cable. These high-speed connectors can be readily manufactured by utilizing stamped contacts and molded housings.
Public/Granted literature
- US11594849B2 Integrated high frequency connector Public/Granted day:2023-02-28
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