- 专利标题: GOLD POWDER, PRODUCTION METHOD FOR GOLD POWDER, AND GOLD PASTE
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申请号: US17632221申请日: 2020-07-20
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公开(公告)号: US20220219237A1公开(公告)日: 2022-07-14
- 发明人: Toshinori OGASHIWA , Masayuki MIYAIRI
- 申请人: TANAKA KIKINZOKU KOGYO K.K.
- 申请人地址: JP Tokyo
- 专利权人: TANAKA KIKINZOKU KOGYO K.K.
- 当前专利权人: TANAKA KIKINZOKU KOGYO K.K.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2019-144018 20190805
- 国际申请: PCT/JP2020/028007 WO 20200720
- 主分类号: B22F9/18
- IPC分类号: B22F9/18 ; B22F1/05 ; B22F1/10 ; B29C65/02
摘要:
A gold powder comprising gold having a purity of 99.9% by mass or more and having an average particle size of 0.01 μm or more and 1.0 μm or less, a content of a chloride ion is 100 ppm or less, and a content of a cyanide ion is 10 ppm or more and 1000 ppm or less. A total of the content of a chloride ion and the content of a cyanide ion is preferably 110 ppm or more and 1000 ppm or less. The gold powder has improved adaptability to various processes including bonding or the like with a content of a chloride ion, that is, an impurity, optimized. A gold paste using this gold powder is suitably used in various uses for bonding such as die bonding of a semiconductor chip, sealing a semiconductor package, and forming an electrode/wire.