An embodiment of the invention of this application provides a polishing pad that eliminates a gap between an optical connector and a polishing film during polishing. A polishing pad of the embodiment is used by being placed between a polishing platen and a polishing sheet in a case of performing spherical polishing of an end surface of an optical connector including an optical fiber and a ferrule. The optical connector polishing pad of the embodiment has rebound resilience higher than 20%. The optical connector polishing pad of the embodiment can be formed from a urethane-based material.