- 专利标题： SOLDERING IRON INCLUDING TEMPERATURE PROFILING AND METHOD OF USE
-
申请号： US17150817申请日： 2021-01-15
-
公开(公告)号： US20220226918A1公开(公告)日： 2022-07-21
- 发明人: Hoa Dinh Nguyen
- 申请人： OK International, Inc.
- 申请人地址： US CA Cyprus
- 专利权人： OK International, Inc.
- 当前专利权人： OK International, Inc.
- 当前专利权人地址： US CA Cyprus
- 主分类号： B23K3/03
- IPC分类号： B23K3/03 ; B23K3/02
摘要：
A soldering iron with temperature profiling, comprising a hand piece or a robot arm including a soldering tip; a processor configured to provide temperature profiling where the soldering tip is one or more of the following during a soldering event: provided at multiple tip temperatures at fixed times during the soldering event; and provided at multiple tip temperatures at self-adjusting times during the soldering event.
信息查询
IPC分类:
