Invention Application
- Patent Title: METHOD OF MANUFACTURING A MASTER FOR A REPLICATION PROCESS
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Application No.: US17607089Application Date: 2020-05-28
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Publication No.: US20220229362A1Publication Date: 2022-07-21
- Inventor: Ji Wang , Kam Wah Leong , QiChuan Yu , Sundar Raman Gnana Sambandam
- Applicant: ams Sensors Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- International Application: PCT/SG2020/050312 WO 20200528
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/16

Abstract:
A method of manufacturing a master for use in a wafer-scale replication process is disclosed. The method comprises at least one step of forming a layer of photoresist on a substrate and exposing the layer of photoresist to a radiation pattern to form at least one patterned layer. The method also comprises a step of developing the at least one patterned layer to provide one or more structures defining the master. In an embodiment, the at least one step of forming the layer of photoresist comprises a process of dry film lamination.
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