A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic. chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.