Invention Application
- Patent Title: CAMERA MODULE
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Application No.: US17507046Application Date: 2021-10-21
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Publication No.: US20220244562A1Publication Date: 2022-08-04
- Inventor: Ki Hoon JANG , Gab Yong KIM , Sang Ho LEE
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0014264 20210201
- Main IPC: G02B27/64
- IPC: G02B27/64 ; G03B5/06 ; H04N5/225 ; H04N5/232

Abstract:
A camera module includes: a housing; an optical assembly configured to tilt with respect to the housing, and including a lens system and a sensor substrate having an image sensor; a main substrate disposed in the housing and spaced apart from the sensor substrate; and a first flexible substrate and a second flexible substrate configured to connect the sensor substrate to the main substrate. The first flexible substrate and the second flexible substrate are disposed to at least partially overlap each other.
Public/Granted literature
- US12055729B2 Camera module including flexible substrates Public/Granted day:2024-08-06
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