Invention Application
- Patent Title: HIGH RESOLUTION TIME-OF-FLIGHT DEPTH IMAGING
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Application No.: US17166990Application Date: 2021-02-03
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Publication No.: US20220245762A1Publication Date: 2022-08-04
- Inventor: Jian MA , Sergiu Radu GOMA , Biay-Cheng HSEIH
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: G06T3/40
- IPC: G06T3/40 ; G06T7/593 ; G06T7/80 ; G02B26/08

Abstract:
Techniques and systems are provided for high resolution time-of-flight (ToF) depth imaging. In some examples, an apparatus includes a projection system including one or more light-emitting devices, each light-emitting device being configured to illuminate at least one portion of an entire field-of-view (FOV) of the projection system. The entire FOV includes a plurality of FOV portions. The apparatus also includes a receiving system including a sensor configured to sequentially capture a plurality of images based on a plurality of illumination reflections corresponding to light emitted by the one or more light-emitting devices. Each image of the plurality of images corresponds to one of the plurality of FOV portions. An image resolution associated with each image corresponds to a full resolution of the sensor. The apparatus further includes a processor configured to generate, using the plurality of images, an increased resolution depth map associated with the entire FOV.
Public/Granted literature
- US11763425B2 High resolution time-of-flight depth imaging Public/Granted day:2023-09-19
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