Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHODS OF FORMING
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Application No.: US17161978Application Date: 2021-01-29
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Publication No.: US20220246611A1Publication Date: 2022-08-04
- Inventor: Han-Yu Tang , Hung-Tai Chang , Ming-Hua Yu , Yee-Chia Yeo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/66 ; H01L29/78 ; H01L21/8234

Abstract:
An embodiment includes a first fin extending from a substrate. The device also includes a first gate stack over and along sidewalls of the first fin. The device also includes a first gate spacer disposed along a sidewall of the first gate stack. The device also includes a first epitaxial source/drain region in the first fin and adjacent the first gate spacer, an outer surface of the epitaxial first source/drain region having more than eight facets in a first plane, the first plane being orthogonal to a top surface of the substrate.
Public/Granted literature
Information query
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