Invention Application
- Patent Title: Light-emitting Chip and Light-emitting Substrate
-
Application No.: US17481326Application Date: 2021-09-22
-
Publication No.: US20220254969A1Publication Date: 2022-08-11
- Inventor: Linxia QI , Junjie MA , Yuanda LU , Shanwei YANG , Jiawei ZHAO , Zhijun XIONG , Haiwei SUN , Lingyun SHI , Jinpeng LI
- Applicant: BOE MLED Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing; CN Beijing
- Assignee: BOE MLED Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: BOE MLED Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing; CN Beijing
- Priority: CN202110178736.8 20210207
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L25/075 ; H01L33/38

Abstract:
A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.
Public/Granted literature
- US12261259B2 Light-emitting chip and light-emitting substrate Public/Granted day:2025-03-25
Information query
IPC分类: