Invention Application
- Patent Title: PACKAGE COVER PLATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL AND DISPLAY DEVICE
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Application No.: US17487969Application Date: 2021-09-28
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Publication No.: US20220255040A1Publication Date: 2022-08-11
- Inventor: Chengyuan LUO
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Priority: CN202110181796.5 20210208
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L27/32 ; H01L51/56

Abstract:
The embodiments of the present application provide a package cover plate and a manufacturing method thereof, a display panel and a display device. The package cover plate includes a cover plate structure layer, a spacer structure on a side of the cover plate structure layer, the spacer structure includes a first spacer, and the first spacer includes a water absorbing structure, and an auxiliary electrode layer on a side of the spacer structure facing away from the cover plate structure layer.
Public/Granted literature
- US11925056B2 Package cover plate and manufacturing method thereof, display panel and display device Public/Granted day:2024-03-05
Information query
IPC分类: