Invention Application
- Patent Title: ACETYLENE FLUID SUPPLY PACKAGE, SYSTEM COMPRISING THE SAME AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
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Application No.: US17667861Application Date: 2022-02-09
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Publication No.: US20220260212A1Publication Date: 2022-08-18
- Inventor: Ashwini K. Sinha , Xuemei Song , William S. Kane , Youn-Joung Cho , Wonwoong Chung , Yeonock Han
- Applicant: Ashwini K. Sinha , Xuemei Song , William S. Kane , Youn-Joung Cho , Wonwoong Chung , Yeonock Han
- Applicant Address: US NY East Amherst; US NY East Amherst; US NY Tonawanda; KR Gyeonggi-do; KR Gyeonggi-do; KR Gyeonggi-do
- Assignee: Ashwini K. Sinha,Xuemei Song,William S. Kane,Youn-Joung Cho,Wonwoong Chung,Yeonock Han
- Current Assignee: Ashwini K. Sinha,Xuemei Song,William S. Kane,Youn-Joung Cho,Wonwoong Chung,Yeonock Han
- Current Assignee Address: US NY East Amherst; US NY East Amherst; US NY Tonawanda; KR Gyeonggi-do; KR Gyeonggi-do; KR Gyeonggi-do
- Main IPC: F17C11/00
- IPC: F17C11/00 ; F17C7/00 ; C23C16/26 ; H01L21/762 ; H01L21/02
Abstract:
A composition comprising acetylene fluid at least partially solubilized in an improved solvent is described. The improved solvents exhibit non-toxicity and are further characterized by low vapor pressures to minimize solvent carryover during delivery of the acetylene fluid, while retaining suitable acetylene solubilizing capacity.
Information query
