Invention Application
- Patent Title: OPTOELECTRONIC CONNECTIONS TO PRINTED CIRCUIT BOARDS
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Application No.: US17669438Application Date: 2022-02-11
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Publication No.: US20220260791A1Publication Date: 2022-08-18
- Inventor: Takuya NINOMIYA , Jeffrey GNIADEK , Yim WONG , Tyler Royer
- Applicant: Senko Advanced Components, Inc.
- Applicant Address: US MA Marlborough
- Assignee: Senko Advanced Components, Inc.
- Current Assignee: Senko Advanced Components, Inc.
- Current Assignee Address: US MA Marlborough
- Main IPC: G02B6/38
- IPC: G02B6/38 ; G02B6/42

Abstract:
An optoelectronic module and optoelectronic connector assemblies can be used for releasable connection of a laser source to the module from a location exterior to the module. The construction of the optoelectronic connector assemblies is such that both in connection and disconnection, the electrical contacts are broken before the optical contacts so that the laser may power down before the optical connection is broken. The optoelectronic connection assemblies have blind mating features. Some versions are free of any latching or mechanical interconnection of the optoelectronic connector assemblies to each other. A spring has a construction which permits it to be received onto a cable by lateral movement of the spring.
Public/Granted literature
- US11934020B2 Optoelectronic connections to printed circuit boards Public/Granted day:2024-03-19
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