Invention Application
- Patent Title: DIFFERENTIAL PAIR MODULE, CONNECTOR, COMMUNICATIONS DEVICE, AND SHIELDING ASSEMBLY
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Application No.: US17743760Application Date: 2022-05-13
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Publication No.: US20220271458A1Publication Date: 2022-08-25
- Inventor: Zewen WANG , Jun CHEN , Wang XIONG
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Priority: CN201921986199.4 20191114
- Main IPC: H01R12/73
- IPC: H01R12/73 ; H01R13/6587 ; H01R13/6476

Abstract:
This application provides a differential pair module, including a first signal terminal and a second signal terminal. The first signal terminal includes a first signal tail part, a first signal body part, and a first signal conductive connection part that are successively connected. An extension plane of the first signal conductive connection part and an extension plane of the first signal body part form an included angle, and an extension direction of the first signal conductive connection part and an extension direction of the first signal tail part form an included angle. The second signal terminal includes a second signal tail part, a second signal body part, and a second signal conductive connection part that are successively connected. Solutions in this application can implement a PCB board connection architecture having no backplane.
Information query
IPC分类: