Invention Application
- Patent Title: Packing Coil
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Application No.: US17663781Application Date: 2022-05-17
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Publication No.: US20220273314A1Publication Date: 2022-09-01
- Inventor: Jake Le , Heath Bowman
- Applicant: MicroVention, Inc.
- Applicant Address: US CA Aliso Viejo
- Assignee: MicroVention, Inc.
- Current Assignee: MicroVention, Inc.
- Current Assignee Address: US CA Aliso Viejo
- Main IPC: A61B17/12
- IPC: A61B17/12
Abstract:
An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
Public/Granted literature
- US12048438B2 Packing coil Public/Granted day:2024-07-30
Information query
