Invention Application
- Patent Title: ANTI-FINGERPRINT ENCLOSURES
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Application No.: US17637476Application Date: 2019-11-14
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Publication No.: US20220276679A1Publication Date: 2022-09-01
- Inventor: Kuan-Ting Wu , Ya-Ting Yeh , Hsing-Hung Hsieh
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2019/061415 WO 20191114
- Main IPC: G06F1/16
- IPC: G06F1/16 ; C23C18/12 ; C23C28/00 ; C25D11/24

Abstract:
Examples of an anti-fingerprint enclosure for an electronic device have been described. In an example, the enclosure comprises an aluminum alloy substrate; a sealing layer deposited on a surface of the aluminum alloy substrate; and a magnesium fluoride sol-gel derived film deposited on the sealing layer, wherein the magnesium fluoride sol-gel derived film exhibits a refractive index of from about 1.36 to about 1.44.
Information query