Invention Application
- Patent Title: SPARSITY-BASED NEURAL NETWORK MAPPING TO COMPUTING UNITS IN A SYSTEM-ON-CHIP
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Application No.: US17194202Application Date: 2021-03-05
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Publication No.: US20220284271A1Publication Date: 2022-09-08
- Inventor: Hee Jun PARK , Colin Beaton VERRILLI
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: G06N3/063
- IPC: G06N3/063 ; G06F9/50 ; G06F11/30 ; G06F11/34
Abstract:
A method for an artificial neural network includes receiving a set of input values to be convolved with multiple kernels via multiple computing units. One or more thermally-stressed computing units of the multiple computing units are determined. The multiple kernels are mapped to the multiple computing units of a system-on-chip (SOC) based on the one or more thermally-stressed computing units. A convolution is performed on the set of input values and a most sparse kernel of the multiple kernels on the most thermally-stressed computing unit.
Information query
