Invention Application
- Patent Title: SEMICONDUCTOR MODULE
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Application No.: US17678240Application Date: 2022-02-23
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Publication No.: US20220285245A1Publication Date: 2022-09-08
- Inventor: Shohei NAGAI
- Applicant: DENSO CORPORATION , TOYOTA JIDOSHA KABUSHIKI KAISHA , MIRISE Technologies Corporation
- Applicant Address: JP Kariya-city; JP Toyota-shi; JP Nisshin-shi
- Assignee: DENSO CORPORATION,TOYOTA JIDOSHA KABUSHIKI KAISHA,MIRISE Technologies Corporation
- Current Assignee: DENSO CORPORATION,TOYOTA JIDOSHA KABUSHIKI KAISHA,MIRISE Technologies Corporation
- Current Assignee Address: JP Kariya-city; JP Toyota-shi; JP Nisshin-shi
- Priority: JP2021-036074 20210308
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L23/367
Abstract:
A semiconductor module includes a substrate, a semiconductor element and a heat sink plate. The substrate is included in a circuit board. The semiconductor element is disposed at the heat sink plate inside the substrate. A fluid is sealed inside the heat sink plate.
Information query
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