Invention Application
- Patent Title: SUBSTRATE STRUCTURES AND SEMICONDUCTOR STRUCTURES
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Application No.: US17752793Application Date: 2022-05-24
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Publication No.: US20220285282A1Publication Date: 2022-09-08
- Inventor: Wu Chou HSU , Min-Yao CHEN
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/31 ; H01L23/00 ; H01L21/48
Abstract:
A substrate structure, a method for manufacturing the same and a semiconductor package structure including the same are provided. The substrate structure includes a substrate, a first electronic component, a second electronic component and a plurality of metal layers. The first electronic component is disposed within the substrate. The second electronic component is disposed within the substrate and arranged in a horizontal direction with the first electronic component. The metal layers are disposed above an upper surface of the substrate. The number of metal layers above the first electronic component is greater than the number of metal layers above the second electronic component.
Information query
IPC分类:
