Invention Application
- Patent Title: FULL-REFLECTION DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND FULL-REFLECTION DISPLAY DEVICE
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Application No.: US17624878Application Date: 2021-04-15
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Publication No.: US20220285406A1Publication Date: 2022-09-08
- Inventor: Jiguo WANG , Jian SUN , Jiantao LIU
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Priority: CN202010402256.0 20200513
- International Application: PCT/CN2021/087469 WO 20210415
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
The present disclosure provides a full-reflection display substrate, a manufacturing method thereof and a full-reflection display device. The full-reflection display substrate includes: a base substrate, the base substrate including a display region and a non-display region; a signal line arranged in the display region; a bonding pin arranged in the non-display region, coupled to the signal line and bonded to a driving circuitry; a reflection layer arranged in the display region; and an etch stop pattern arranged at a same layer and made of a same material as the reflection layer, arranged in the non-display region, and at least covering a side surface of the bonding pin.
Information query
IPC分类: