An electronic component includes a first and second inductor forming sections integrated with a stack, and a connection conductor layer connecting the first and second inductor forming sections inside the stack. In the first inductor forming section, two first through hole lines are connected to a wide portion of an inductor conductor layer, and two second through hole lines are connected to a narrow portion of the inductor conductor layer. In the second inductor forming section, two first through hole lines are connected to a wide portion of an inductor conductor layer, and two second through hole lines are connected to a narrow portion of the inductor conductor layer.