Invention Application
- Patent Title: METHOD FOR SUPPRESSING INCREASE IN ZINC CONCENTRATION OF PLATING SOLUTION AND METHOD FOR MANUFACTURING ZINC-BASED PLATING MEMBER
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Application No.: US17297470Application Date: 2020-08-21
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Publication No.: US20220298668A1Publication Date: 2022-09-22
- Inventor: Toshihiro SUGIURA , Yasunori AOKI
- Applicant: YUKEN INDUSTRY CO., LTD.
- Applicant Address: JP Aichi
- Assignee: YUKEN INDUSTRY CO., LTD.
- Current Assignee: YUKEN INDUSTRY CO., LTD.
- Current Assignee Address: JP Aichi
- Priority: JP2019-214897 20191128
- International Application: PCT/JP2020/031629 WO 20200821
- Main IPC: C25D21/14
- IPC: C25D21/14 ; C25D3/56 ; C25D17/00

Abstract:
Provided is a method for suppressing an increase in the zinc concentration of a plating solution when a zinc alloy plating member using nickel as an alloy element is manufactured using a zinc alloy plating apparatus. The plating apparatus includes: a plating tank; a first diaphragm tank having a first diaphragm; a cathode holding member; a first anode holding member; a soluble zinc-containing member held by the first anode holding member; a soluble metal-containing member containing the nickel which is the alloy element; and a second anode holding member for anode-electrolyzing the soluble metal-containing member. The first diaphragm tank is arranged in a manner that the first electrolytic solution is in contact with one surface of the first diaphragm and the plating solution is in contact with the other surface of the first diaphragm during use.
Information query