Invention Application
- Patent Title: Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells
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Application No.: US17836357Application Date: 2022-06-09
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Publication No.: US20220302154A1Publication Date: 2022-09-22
- Inventor: John D. Hopkins , Nancy M. Lomeli
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L27/11556
- IPC: H01L27/11556 ; H01L27/11519 ; H01L27/11582 ; H01L27/11565 ; H01L27/1157 ; H01L27/11524

Abstract:
A memory array comprising strings of memory cells comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Channel-material-string structures of memory cells extend through the insulative tiers and the conductive tiers. The channel-material-string structures individually comprise an upper portion above and joined with a lower portion. Individual of the channel-material-string structures comprise at least one external jog surface in a vertical cross-section where the upper and lower portions join. Other embodiments, including method are disclosed,
Public/Granted literature
Information query
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