Invention Application
- Patent Title: Liquid Ejecting Head And Liquid Ejecting Apparatus
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Application No.: US17701732Application Date: 2022-03-23
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Publication No.: US20220305788A1Publication Date: 2022-09-29
- Inventor: Takahiro KANEGAE , Katsuhiro OKUBO , Kentaro MURAKAMI , Shingo TOMIMATSU , Hiroki KOBAYASHI , Haruhisa UEZAWA
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2021-049385 20210324
- Main IPC: B41J2/15
- IPC: B41J2/15 ; B41J2/14

Abstract:
A liquid ejecting head includes: a plurality of head chips having a nozzle surface; a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure and along a direction parallel to the nozzle surface, in which the heater overlaps the plurality of head chips in a plan view.
Public/Granted literature
- US11981136B2 Liquid ejecting head and liquid ejecting apparatus Public/Granted day:2024-05-14
Information query
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