Invention Application
- Patent Title: METHOD FOR MANUFACTURING MULTILAYER COIL COMPONENT AND MULTILAYER COIL COMPONENT
-
Application No.: US17694999Application Date: 2022-03-15
-
Publication No.: US20220310320A1Publication Date: 2022-09-29
- Inventor: Noriaki HAMACHI , Toshinori MATSUURA , Junichiro URABE , Kazuya TOBITA , Yuto SHIGA , Youichi KAZUTA , Yuichi TAKUBO
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2021-053720 20210326
- Main IPC: H01F41/04
- IPC: H01F41/04 ; H01F41/10 ; H01F27/28 ; H01F27/29

Abstract:
A method for manufacturing a multilayer coil component 1 includes: a step of forming an insulator layer 10; a step of forming a first coil conductor 20, a second coil conductor 21, a third coil conductor 22, and a fourth coil conductor 23; a step of obtaining a laminate L formed by laminating the insulator layer 10, the first coil conductor 20, the second coil conductor 21, the third coil conductor 22, and the fourth coil conductor 23; and a step of forming terminal electrodes 4 and 5 on the outer surface of the laminate L by a photolithography method.
Information query