- 专利标题: SENSING DEVICE AND METHOD FOR MANUFACTURING SENSING DEVICE
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申请号: US17656446申请日: 2022-03-25
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公开(公告)号: US20220315413A1公开(公告)日: 2022-10-06
- 发明人: Etsuji HAYAKAWA , Taketomo NAKANE
- 申请人: Etsuji HAYAKAWA , Taketomo NAKANE
- 申请人地址: JP Tokyo; JP Tokyo
- 专利权人: Etsuji HAYAKAWA,Taketomo NAKANE
- 当前专利权人: Etsuji HAYAKAWA,Taketomo NAKANE
- 当前专利权人地址: JP Tokyo; JP Tokyo
- 优先权: JP2021-058777 20210330
- 主分类号: B81B7/00
- IPC分类号: B81B7/00 ; B81C1/00
摘要:
A sensing device includes a lead frame, a first insulating film, a semiconductor integrated circuit chip provided over the lead frame via the first insulating film, and a first bonding wire via which an external derivation lead and the semiconductor integrated circuit chip are electrically coupled to each other. The sensing device includes a sensor chip disposed over the semiconductor integrated circuit chip such that a first surface of the sensor chip faces the semiconductor integrated circuit chip. The sensing device includes a sensor provided on a second surface of the sensor chip. The sensing device includes a molding resin with which the lead frame, the semiconductor integrated circuit chip, the sensor chip, and the first bonding wire are sealed. The sensor chip is electrically coupled to the semiconductor integrated circuit chip, and the molding resin has an opening in which the sensor is exposed.