发明申请
- 专利标题: FINGERPRINT RECOGNITION MODULE, FABRICATING METHOD THEREOF AND DISPLAY DEVICE
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申请号: US17419835申请日: 2020-09-25
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公开(公告)号: US20220320170A1公开(公告)日: 2022-10-06
- 发明人: Xiaoquan HAI , Lei WANG , Xuan LIANG , Yingzi WANG
- 申请人: BOE Technology Group Co., Ltd.
- 申请人地址: CN Beijing
- 专利权人: BOE Technology Group Co., Ltd.
- 当前专利权人: BOE Technology Group Co., Ltd.
- 当前专利权人地址: CN Beijing
- 国际申请: PCT/CN2020/117904 WO 20200925
- 主分类号: H01L27/146
- IPC分类号: H01L27/146
摘要:
The fingerprint recognition module includes: a base substrate; an image sensing layer including sensors on the base substrate; a collimating optical layer on incident sides of the sensors and including light transmitting holes formed in one-to-one correspondence with part of the sensors, an orthographic projection of each of the light transmitting holes on the base substrate being in an orthographic projection of a corresponding sensor; and a light guiding layer on a side of the collimating optical layer facing away from the sensors and including microlenses. An orthographic projection of each of the microlenses on the base substrate completely covers orthographic projections of one of the light transmitting holes and at least two sensors, and each microlens is configured to converge light rays reflected by a finger and then transmit the converged light rays to the one sensor that it covers through the one light transmitting hole that it covers.
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