- 专利标题: ENCAPSULATION RESIN
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申请号: US17858431申请日: 2022-07-06
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公开(公告)号: US20220332880A1公开(公告)日: 2022-10-20
- 发明人: Yoshito TANAKA , Makoto MATSUURA , Yuuki SUZUKI , Akitoshi OGATA , Yosuke KISHIKAWA
- 申请人: DAIKIN INDUSTRIES, LTD.
- 申请人地址: JP Osaka
- 专利权人: DAIKIN INDUSTRIES, LTD.
- 当前专利权人: DAIKIN INDUSTRIES, LTD.
- 当前专利权人地址: JP Osaka
- 优先权: JP2020-001646 20200108
- 主分类号: C08G4/00
- IPC分类号: C08G4/00
摘要:
An object of the present disclosure is to provide an encapsulation resin in which the occurrence of cracks is suppressed when the resin is used for encapsulation of ultraviolet light-emitting elements. Another object of the present disclosure is to provide an encapsulation resin composition for supplying the encapsulation resin. The present disclosure relates to an encapsulation resin for light-emitting elements, comprising a fluoropolymer, wherein the fluoropolymer comprises, as a main component, a monomer unit represented by formula (1): wherein R1 to R4 are each independently a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group.
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