Invention Application
- Patent Title: DOWNHOLE MULTIDIMENSIONAL IMAGING FEATURE EXTRACTION METHOD AND IMAGING APPARATUS
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Application No.: US17753481Application Date: 2020-08-26
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Publication No.: US20220333478A1Publication Date: 2022-10-20
- Inventor: Yijin ZENG , Wei ZHANG , Weining NI , Xin LI , Lipeng YAN , Jinping WU , Yuefa HU , Lishuang WANG , Zuyang ZHU , Jintai MI
- Applicant: CHINA PETROLEUM & CHEMICAL CORPORATION , SINOPEC RESEARCH INSTITUTE OF PETROLEUM ENGINEERING
- Applicant Address: CN Beijing; CN Beijing
- Assignee: CHINA PETROLEUM & CHEMICAL CORPORATION,SINOPEC RESEARCH INSTITUTE OF PETROLEUM ENGINEERING
- Current Assignee: CHINA PETROLEUM & CHEMICAL CORPORATION,SINOPEC RESEARCH INSTITUTE OF PETROLEUM ENGINEERING
- Current Assignee Address: CN Beijing; CN Beijing
- Priority: CN201910837890.4 20190905
- International Application: PCT/CN2020/111392 WO 20200826
- Main IPC: E21B47/002
- IPC: E21B47/002 ; E21B47/18 ; E21B47/13

Abstract:
An apparatus for downhole multi-dimensional imaging includes an acquisition unit configured to acquire a formation resistivity signal, an ultrasonic echo signal and an orientation signal regularly; a sector calculation unit configured to calculate, based on said orientation signal, a sector where a currently acquired signal is from; and a multi-dimensional imaging unit, configured to calculate, based on the signals acquired by the acquisition unit, data of resistivity, distance from a drilling tool to a borehole wall and ultrasonic echo amplitude, and distribute said data into all sectors for feature recognition and extraction, thus obtaining key features characterizing a current formation being drilled, said key features being transmitted to ground for guiding drilling process. The structural complexity and the length of the downhole imaging measurement instrument can be reduced, and feature recognition can be directly performed on the imaging data underground.
Public/Granted literature
- US11913324B2 Downhole multidimensional imaging feature extraction method and imaging apparatus Public/Granted day:2024-02-27
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