Invention Application
- Patent Title: MULTI-BIT FLIP-FLOP AND INTEGRATED CIRCUIT INCLUDING THE SAME
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Application No.: US17551974Application Date: 2021-12-15
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Publication No.: US20220334182A1Publication Date: 2022-10-20
- Inventor: Chunghee KIM , Ahreum KIM , Minsu KIM , Seungman LIM
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0048673 20210414
- Main IPC: G01R31/3185
- IPC: G01R31/3185

Abstract:
A multi-bit flip-flop includes a first flip-flop having a first output driver connected to a first output pin and arranged on a first row, a second flip-flop including a second output driver electrically connected to a second output pin and arranged on a second row, and an internal hold buffer connected to the first output driver on the first row and the second flip-flop on the second row.
Public/Granted literature
- US11988712B2 Multi-bit flip-flop and integrated circuit including the same Public/Granted day:2024-05-21
Information query
IPC分类: