Invention Application
- Patent Title: Electronic Device Substrate, Manufacturing Method Thereof, and Electronic Device
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Application No.: US17847877Application Date: 2022-06-23
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Publication No.: US20220336503A1Publication Date: 2022-10-20
- Inventor: Kui Zhang , Pengcheng Lu , Li Liu , Yunlong Li , Dacheng Zhang
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
An electronic device substrate, a manufacturing method thereof, and an electronic device are provided. The electronic device substrate includes a base substrate, a first insulating layer, and light-emitting sub-units, a first conductive member and a second conductive member, which are on a side of the first insulating layer away from the base substrate. The light-emitting sub-units and the first conductive member are respectively in array region and periphery region, and the second conductive member is between the first conductive member and the array region; orthogonal projections of the first and second conductive members on the base substrate are spaced apart; each light-emitting sub-unit includes first and second driving electrodes, second driving electrodes of the light-emitting sub-units are integrated to form a first common electrode layer; the periphery region further includes a second common electrode layer electrically connected to the first conductive member and the first common electrode layer.
Public/Granted literature
- US11749691B2 Electronic device substrate, manufacturing method thereof, and electronic device Public/Granted day:2023-09-05
Information query
IPC分类: