The embodiment of the present disclosure provides a driving backplate including a base substrate, and an insulation layer and a plurality of conductive structures on the base substrate. The insulation layer insulates the plurality of conductive structures from each other. The plurality of conductive structures includes a first conductive layer and a second conductive layer sequentially stacked along a direction away from the base substrate. At least one portion of a region in which the first conductive layer is in contact with the second conductive layer includes a flat contact region. An opening is formed at a position in the insulation layer corresponding to the conductive structure. An edge of the opening in the insulation layer is between the first conductive layer and the second conductive layer and is correspondingly in edge regions of the first conductive layer and the second conductive layer.