Invention Application
- Patent Title: HIGH TEMPERATURE INTERFACES FOR CERAMIC COMPOSITES
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Application No.: US17302014Application Date: 2021-04-21
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Publication No.: US20220348509A1Publication Date: 2022-11-03
- Inventor: Mehrad Mehr , Bahram Jadidian
- Applicant: Honeywell International Inc.
- Applicant Address: US NC Charlotte
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NC Charlotte
- Main IPC: C04B37/00
- IPC: C04B37/00 ; F16D65/12 ; B32B18/00

Abstract:
An article for a high temperature environment includes a first ceramic composite substrate, a second ceramic composite substrate, and a high temperature interface between a first surface of the first ceramic composite substrate and a second surface of the second ceramic composite substrate. The high temperature interface includes at least one high temperature interface layer that includes a ceramic matrix and a plurality of fibers distributed through the ceramic matrix.
Public/Granted literature
- US11866377B2 High temperature interfaces for ceramic composites Public/Granted day:2024-01-09
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